H58G66CK8BX147N

• SK Hynix H58G Series LPDDR5X Synchronous SDRAM, 64Gb (8GB) Density
• 16-Bit Data Bus width, 4266M Hz Rated Frequency
• 1.05V Operating supply; 1.01V-1.12V and 1.7V-1.95V Rail Ranges
• 315-Ball FBGA, Surface-Mount
• -40C to +85C Operating Temperature Range with -40C Cold-Start Capability
• High Density on a Narrow bus, Suited to Multi-Device Wide-Bus Topologies

The H58G66CK8BX147N is an SK Hynix LPDDR5X mobile SDRAM from the H58G series, supplied in a 315-ball FBGA surface-mount package. It provides 64Gb of density, equivalent to 8GB, on a 16-bit data bus at a rated 4266M Hz. The device operates from a 1.05V supply with rail ranges of 1.01V-1.12V and 1.7V-1.95V. SK Hynix specifies the H58G66CK8BX147N over a -40C to +85C operating temperature range.

A 64Gb device on a 16-bit bus is built for topologies where designers place several packages to widen the memory interface while keeping each device physically small and routable. That approach is standard in flagship mobile processors, on-device AI accelerators, automotive central compute and cockpit platforms, AR and XR headsets, and high-throughput networking silicon. The -40C lower limit on the H58G66CK8BX147N extends its reach into industrial and vehicle environments that a purely commercial LPDDR5X part cannot cover. Buyers are typically OEM platform teams, automotive Tier 1 suppliers, and memory module assemblers building multi-die subsystems around a single SoC.