W66DP2RQQAGJ
- Description
- DRAM Chip Mobile LPDDR4X SDRAM 8Gbit 256Mx32 1.1V/1.8V 200-Pin
- Memory Technology
- LPDDR4X
- Memory Type
- SDRAM
- Access Time
- 3.5ns
Quantity
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- Winbond LPDDR4X Synchronous SDRAM, 8Gb Density
- 1.866G Hz Rated frequency, 3.5ns Access Time
- Supply Rails Specified at 1.06V-1.17V and 1.7V-1.95V
- 200-Pin TFBGA, Surface-Mount
- -40C to +105C Extended Operating Temperature Range
- Active Lifecycle Status
The W66DP2RQQAGJ is a Winbond LPDDR4X mobile SDRAM providing 8Gb of density in a 200-pin TFBGA surface-mount package. It is rated at 1.866G Hz with a 3.5ns access time and operates from rails specified at 1.06V-1.17V and 1.7V-1.95V. Winbond rates the W66DP2RQQAGJ across a -40C to +105C operating temperature range and lists it with Active lifecycle status.
Winbond specialises in long-lifecycle memory for embedded and industrial customers, so parts of this class are usually specified where supply continuity matters as much as performance. An 8Gb LPDDR4X device provides 1GB of main memory, which suits RTOS and lightweight Linux systems: industrial controllers and HMI panels, automotive body and telematics modules, IP cameras and video doorbells, smart meters, medical monitoring devices, and networking customer premises equipment. The -40C to +105C range on the W66DP2RQQAGJ covers automotive and outdoor ambient conditions. Buyers are typically industrial and automotive OEMs seeking a second source with a longer committed availability window than the large mobile DRAM vendors offer.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Quantity
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.