KHAA84901B-JC17T00
- Description
- HBM2E 16GB x 1024 3.5V 3.6GHz -40°C~85°C MPGA-1024
Quantity
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- High Bandwidth Memory Technology HBM2E
- Memory Size of 16GB
- Data Bus Width of 1024b
- Operating Supply Voltage of 3.5V
- Access Time of 32ms
- Temperature Range from -40°C to 85°C
The Samsung HBM2E 16GB x 1024 is a cutting-edge high bandwidth memory solution designed for high-performance computing applications. With a remarkable data transfer rate of 3.6GHz, this DRAM component is optimized for speed and efficiency, making it ideal for data-intensive tasks. The MPGA-1024 package ensures a compact footprint while providing robust performance across a wide temperature range from -40°C to 85°C. This memory module is perfect for advanced graphics processing, AI applications, and high-speed data processing environments.
The HBM2E 16GB x 1024 is designed for high-performance computing applications that require fast memory access and large bandwidth. Its unique architecture makes it suitable for graphics processing units (GPUs), machine learning, and data-intensive tasks. Typically used by data centers and system developers, this memory module enhances the efficiency and speed of modern computing systems.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Quantity
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.