H9JCNNNBK3MLYR-N6E
- Description
- LPDDR5 16Gb x 16 1.05V 6400MHz -55°C~125°C BGA-315
- Memory Technology
- LPDDR5
- Memory Type
- SDRAM
- Data Bus Width
- 16b
- Memory Size
- 16Gb
Quantity
9,520 AvailableLet us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
- SK Hynix H9JCNNN Series LPDDR5 Synchronous SDRAM, 16Gb Density
- 16-Bit Data Bus width, 6400M Hz Rated Frequency
- 1.05V Operating supply; 1.01V-1.12V and 1.7V-1.95V Rail Ranges
- 315-Ball BGA, Surface-Mount
- Listed Operating Temperature Range of -55C to +125C
- LPDDR5 Generation: Lower Core Voltage and Higher Bandwidth per Pin Than LPDDR4X
The H9JCNNNBK3MLYR-N6E is an SK Hynix LPDDR5 mobile SDRAM from the H9JCNNN series, supplied in a 315-ball BGA surface-mount package. It provides 16Gb of density on a 16-bit data bus at 6400M Hz, operating from a 1.05V supply with rail ranges of 1.01V-1.12V and 1.7V-1.95V. The H9JCNNNBK3MLYR-N6E is listed with a -55C to +125C operating temperature range, the widest grade in the catalog for this family.
LPDDR5 is the current low-power DRAM generation for bandwidth-hungry mobile and edge processors, delivering more throughput per pin at a lower core voltage than LPDDR4X. A 16Gb x16 device such as the H9JCNNNBK3MLYR-N6E is normally deployed in pairs or quads to build a wider bus for flagship application processors, automotive compute platforms, edge AI inference modules, and high-end networking silicon. The wide listed temperature range points it at under-hood and outdoor deployments rather than handset use. Buyers are typically automotive and industrial compute OEMs, plus module houses assembling multi-die memory subsystems around an SoC.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Quantity
9,520 AvailableLet us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.