K4ZAF325BM-HC16
- Description
- GDDR6 16Gb x 32 1.35V 16GHz 0°C~95°C FBGA-180
- Memory Technology
- GDDR6
- Memory Type
- SDRAM
- Data Bus Width
- 32b
- Memory Size
- 16Gb
Quantity
20,160 AvailableLet us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
- High-Speed Data Transfer at 16GHz
- 16Gb Density for Enhanced Memory Capacity
- 1.35V Operating Supply Voltage for Energy Efficiency
- Synchronous SDRAM Technology for Improved Performance
- 180-Pin FBGA Package for Space-Saving Design
The Samsung GDDR6 16Gb x 32 memory module is designed for high-performance applications requiring fast data processing and efficient power consumption. With a remarkable frequency of 16GHz and a synchronous interface, this memory module is ideal for graphics-intensive tasks and advanced computing environments. Its compact FBGA package ensures easy integration into various electronic systems while maintaining optimal thermal performance across a wide operating temperature range from 0°C to 95°C.
The 16G Bit GDDR6 SDRAM Chip is designed for high-performance computing applications, offering a memory density of 16Gb with a 32-bit data bus width. Operating at a frequency of 16GHz and utilizing a supply voltage of 1.35V, this synchronous memory chip is suitable for graphics processing units (GPUs) and other demanding applications that require rapid data access and efficient power management. Its surface mount design with 180 pins makes it versatile for various electronic devices, ensuring reliable performance within a temperature range of 0°C to 95°C.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Quantity
20,160 AvailableLet us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.