K4UBE3D4AB-MGCL
- Description
- 32GB 8GX32 1.1V, 1.8V 4.266GHZ 32 Bit FBGA-200
- Memory Technology
- LPDDR4X
- Memory Type
- SDRAM
- Data Bus Width
- 32b
- Memory Size
- 32Gb
Quantity
16,000 AvailableLet us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
- Samsung LPDDR4X Synchronous SDRAM, 256Gb (32GB) Density
- 32-Bit Data Bus Width
- 4266M Hz Rated Frequency
- 1.8V Operating supply; 1.06V-1.17V and 1.7V-1.95V Rail Ranges
- 200-Ball FBGA, Surface-Mount
- -25C to +85C Operating temperature, Production Lifecycle Status
The K4UBE3D4AB-MGCL is a Samsung LPDDR4X mobile SDRAM supplied in a 200-ball FBGA package. It carries 256Gb of density (32GB) organized on a 32-bit data bus and is rated for 4266M Hz operation. The device operates from a 1.8V supply, with rail ranges specified at 1.06V-1.17V and 1.7V-1.95V, and is listed in Production lifecycle status. Samsung rates the K4UBE3D4AB-MGCL for an operating temperature range of -25C to +85C.
LPDDR4X is a low-power mobile DRAM standard used as main system memory where power budget and board area are constrained. Parts of this class are specified into smartphones and tablets, automotive infotainment and driver-assistance modules, set-top boxes, networking line cards, and embedded edge-compute boards. The 32-bit bus and 200-ball FBGA of the K4UBE3D4AB-MGCL allow it to be attached directly to an SoC memory controller rather than through a socketed module. Typical buyers are OEM design teams and contract manufacturers building Samsung-qualified LPDDR4X platforms that operate within the -25C to +85C range.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Quantity
16,000 AvailableLet us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.